正在供货 Currently supplying

AG16K

16K LEs，LQFP-144，FBGA-256 package
在淘宝查看
PRODUCT DEFINITION / 产品定义
AG16K 系列 FPGA 设备专为高产量、成本敏感型应用而设计，使系统设计师能够满足日益增长的性能需求的同时降低成本。该设备 AG16K 具有卓越的品质、稳定性以及极高的性价比。
AG16K FPGA devices are targeted to high-volume, cost-sensitive, applications, enabling system designers to meet increasing performance requirements while lowering costs. The device AG16K offers supreme quality, stability, and exceptional pricing value.
IDEAL FOR / 适用场景
  • 工业控制与自动化 Industrial control and automation
  • 通信设备 Communication equipment
  • 消费电子 Consumer electronics
  • 视频与图像处理 Video and image processing
  • 医疗设备 Medical equipment
  • 测试测量 Test and measurement
  • 嵌入式系统 Embedded systems

特性 Feature

  • 高密度架构，采用16K LE
  • High-density architecture with 16K LEs

  • 最高可达504Kbit的内存空间
  • Up to 504Kbits of RAM space

  • 最多可配置56个18×18位嵌入式乘法器，每个可配置为两个独立的9×9位乘法器
  • Up to 56 18 x 18-bit embedded multipliers are each configurable as two independent 9 x 9-bit multipliers

  • 每设备提供4个PLL，实现时钟倍增和相位偏移
  • Provides 4 PLLs per device provide clock multiplication and phase shifting

  • 支持高速差分输入输出标准，包括LVDS、RSDS、mini-LVDS、LVPECL
  • High-speed differential I/O standard support, including LVDS, RSDS, mini-LVDS, LVPECL

  • SSTL、SSTL-II IO 标准，支持 DDR、DDR2
  • SSTL, SSTL-II IO standard, support DDR, DDR2

  • 单端I/O标准支持，包括3.3V、2.5V、1.8V和1.5V LVCMOS和LVTTL
  • Single-ended I/O standard support, including 3.3V, 2.5V, 1.8V, and 1.5V LVCMOS and LVTTL

  • 通用套装选项，LQFP-144和 FBGA-256
  • General package options, LQFP-144 and FBGA-256

  • 两个12位SarADC（嵌入式温度传感器）
  • Two 12-bits SarADC (embedded temp sensor)

  • 通过JTAG和SPI接口实现灵活设备配置
  • Flexible device configuration through JTAG and SPI interface

  • 支持远程更新，类似“双重启动”实现
  • Support remote update, by "dual-boot" like implementation

  • 芯片信号调试支持
  • Support on chip signal debugging

PDF
AG16K_Rev1_0
1 MB
下载