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AG10K

10K LEs，LQFP-144，FBGA-256 package
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PRODUCT DEFINITION / 产品定义
AG10K 系列 FPGA 设备专为高产量、成本敏感型应用而设计，使系统设计师能够满足日益增长的性能需求的同时降低成本。该设备 AG10K 具有卓越的品质、稳定性以及极高的性价比。
AG10K FPGA devices are targeted to high-volume, cost-sensitive, applications, enabling system designers to meet increasing performance requirements while lowering costs. The device AG10K offers supreme quality, stability, and exceptional pricing value.
IDEAL FOR / 适用场景
  • 工业控制与自动化 Industrial control and automation
  • 通信设备 Communication equipment
  • 消费电子 Consumer electronics
  • 视频与图像处理 Video and image processing
  • 医疗设备 Medical equipment
  • 测试测量 Test and measurement
  • 嵌入式系统 Embedded systems

特性 Feature

  • 高密度架构与10K LE
  • High-density architecture with 10K LEs

  • M9K嵌入式内存块，最多可达414Kbit的RAM空间
  • M9K embedded memory blocks, up to 414Kbits of RAM space

  • 最多可配置23个18×18位嵌入式乘法器，每个可配置为两个独立的9×9位乘法器
  • Up to 23 18 x 18-bit embedded multipliers are each configurable as two independent 9 x 9-bit multipliers

  • 每个设备提供2个PLL，实现时钟倍增和相位偏移
  • Provides 2 PLLs per device provide clock multiplication and phase shifting

  • 支持高速差分输入输出标准，包括LVDS、RSDS、mini-LVDS、LVPECL
  • High-speed differential I/O standard support, including LVDS, RSDS, mini-LVDS, LVPECL

  • 单端I/O标准支持，包括3.3V、2.5V、1.8V和1.5V LVCMOS和LVTTL
  • Single-ended I/O standard support, including 3.3V, 2.5V, 1.8V, and 1.5V LVCMOS and LVTTL

  • 通用套装选项，LQFP-144和 FBGA-256
  • General package options, LQFP-144 and FBGA-256

  • 通过JTAG和SPI接口实现灵活设备配置
  • Flexible device configuration through JTAG and SPI interface

  • 支持远程更新，类似“双重启动”实现
  • Support remote update, by "dual-boot" like implementation

  • 请参阅“用户指南”以了解特殊的AS模式配置
  • Refer "User Guide" for special AS mode configuration

PDF
AG10K_Rev1_1
978 KB
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